用户名:  密码:   
网站首页即时通讯活动公告最新消息科技前沿学人动向两岸三地人在海外历届活动关于我们联系我们申请加入
栏目导航 — 美国华裔教授专家网活动公告社区动态
关键字  范围   
 
COMAP:MCM/ICM数学建模大赛 欢迎注册!
2022/11/17 13:00:39 | 浏览:467 | 评论:1
COMAP:MCM/ICM数学建模大赛 欢迎注册!
VIEW WEB VERSION
 
 
COMAP:MCM/ICM数学建模大赛 欢迎注册!
 
 

Apply Mathematics and Model to Win!

2023 Mathematical Contest in Modeling(MCM)® and 2023 Interdisciplinary Contest in Modeling(ICM)®February 16-20, 2023   

COMAP’s Mathematical Contest in Modeling(MCM)and Interdisciplinary Contest in Modeling(ICM)are international contests open to undergraduate students of all disciplines. The MCM/ICM contest problems are designed to provide students with the opportunity to work as team members to engage in and improve their modeling, problem-solving, and writing skills. Teams from your school apply mathematics to model and develop a solution to a real-world problem.For more information or to register your team(s)click the link below.

 
 
 
 
 

Problems in continuous and discrete mathematics, data science, sustainability, operations research, network science, and policy.

Let the contests be part of your in-person, hybrid, or virtual classroom! 

More Contest Details

Each team can have up to three students from the same school. There is no limit on the number of teams a school can register for the contest. Team members may work virtually. Teams work together on the contest problem over the extended weekend February 16-20, 2023. Teams compete for national and international recognition and awards, and could win $10,000!

The MCM/ICM Contest in Modeling is sponsored by COMAP with support from INFORMS, MAA, AMS, ASA, and SIAM. The contest attracts diverse students and faculty advisors from over 1,000 institutions around the world. 

How It Works: Form a modeling team of up to three students. Choose one of six contest problems. Work over five days from February 16-20, 2023 to model and solve your problem. Submit your electronic solution paper to COMAP. The problems you can choose from:

  • MCM Problem A(continuous)
  • MCM Problem B(discrete)
  • MCM Problem C(data insights)
  • ICM Problem D(operations research/network science)
  • ICM Problem E(sustainability)
  • ICM Problem F(policy)

For contest and scholarship details, previous years’ contest problems, FAQs, resources, and registration, go to: www.mcmcontest.com

Why Should Students Compete?

The MCM/ICM offers something for everyone. Some of the biggest benefits for students include:

  1. Develop problem-solving skills
  2. Discover new ways to work in a team environment
  3. Apply knowledge outside the classroom
  4. Learn how to use mathematics as a tool to solve interesting problems
  5. Learn more about a topic or issue facing our world today
  6. Communicate results to technical and non-technical audiences
  7. Ability to effectively use data
  8. Get a resume and interview booster

Click here for more reasons students compete in our math contests.

Benefits for Advisors

In addition to the benefits to students, advisors also have a lot to gain by participating in the MCM/ICM. Some of the benefits to advisors include:

  1. Showcase the value of modeling
  2. Develop students as professionals 
  3. Engage students outside the classroom
  4. Mentor students
  5. Provide extra-curricular opportunities that match your research interests
  6. Create interdisciplinary partnerships with colleagues
  7. Experience joy by hearing students’ positive experiences of solving a complex problem
 
 
 
 
 
 
 
 
 
ACCESS FREE RESOURCES
We have math modeling resources for your in-person, hybrid, or virtual classroom. Get the free materials here.
 
SHARE THIS ANNOUNCEMENT
Download the 2023 MCM/ICM flyer and share contest info with colleagues, friends, and students. We look forward to your teams participating, succeeding, and having fun! 
 
REGISTER TODAY
Get your teams together and register today.
 
FOLLOW US
Follow us on Twitter @COMAPMath for up-to-date contest information. Watch for more detailed information in the coming weeks.
 
QUESTIONS?
Visit comap.com or email us at info@comap.com.
 
 
 
 
COMAP:MCM/ICM数学建模大赛 欢迎注册!
 
COMAP:MCM/ICM数学建模大赛 欢迎注册! COMAP:MCM/ICM数学建模大赛 欢迎注册!
 
 
 
 
 
 
 
相关栏目:『社区动态
南加州大学 USC Trojan Family 简讯 (Jan. 2023) 2023-01-27 [136]
赵美心议员来信:Devastated 2023-01-23 [133]
2023年海外优青指南公布 2023-01-02 [182]
欢迎申请2023年国泰银行奖学金(截止日期 2023年4月15日) 2022-12-27 [314]
中国外交部12308领保热线备用号码变更的通知 2022-12-27 [214]
留学中国:2023/2024 Chinese Government Scholarship Application 2022-12-18 [474]
2022年度“中国国家优秀自费留学生奖学金“申请通知(2/10/2023截止) 2022-12-06 [690]
美国驻华使团致美国公民的声明 2022-11-28 [652]
南加大校友简讯:USC alum’s biopic stars Jim Parsons; Keck doctors perform historic toe-to-hand transplant 2022-11-15 [384]
2022年联合国青年专业人员考试(YPP)— 开始报名 2022-11-05 [663]
相关栏目更多文章
最新图文:
:日本政府《氢能利用进度表》 :美国《2016-2045年新兴科技趋势报告》 :天津工业大学“经纬英才”引进计划 :浙江财经大学国际青年学者论坛的邀请函 (10/31-11/1) :美国加大审查范围 北大多名美国留学生遭联邦调查局质询 :天安门广场喜迎“十一”花团锦簇的美丽景象 马亮:做院长就能够发更多论文?论文发表是不是一场“权力的游戏”? :印裔人才在美碾压华裔:我们可以从印度教育中学到什么?
更多最新图文
更多《即时通讯》>>
WCSM说:留言于2022-12-01 15:39:16(第1条)
7th Annual World Congress of Smart Materials-2023
Hosted by World High Technology Society, we are pleased to launch the 7th Annual World Congress of Smart Materials-2023 (WCSM), which will be held in Sapporo, Japan from Feb. 08-10, 2023. On behalf of the Organizing Committee, we sincerely invite you to this excellent meeting to be a Speaker and deliver a talk on your recent work or act as Session Chair/Delegate. How do you think? Your early reply will be highly appreciated.

Event Basic Information
Time: Feb. 08-10, 2023
Place: Sapporo, Japan
Expected Number: 500+ participants from 50+ countries

Program: Keynote Forum, Parallel Sessions, Exhibition, Poster, Paper, Reception, Tour etc..
Contributors: Oral Speakers, Participants, Sponsors, Exhibitors, Media Partners, Supporters etc..
Topics: 100+ sessions, not limited to basic science & technology, new Components, Sensor, Actuator, next generation materials, translation, innovation, etc..

Smart materials are one of the most important researching directions in development of High-tech new materials. Their properties can react to reversible changes in their environment by an external condition. Smart materials help in removing the boundaries between structural and functional materials, which may result in significant revolution in materials science development. Based on its significance, WCSM-2023 is dedicated to provide a platform to make up a dialogue between industries and academic organizations and technology transfer from research to industry. We look forward to receiving your positive response!

Best Regards,

Organizing Committee of WCSM event
julie@wcsm-2023.com
 
打印本文章
 
您的名字:
电子邮件:
留言内容:
注意: 留言内容不要超过4000字,否则会被截断。
未 审 核:  是
  
关于我们联系我们申请加入后台管理设为主页加入收藏
美国华裔教授专家网版权所有,谢绝拷贝。如欲选登或发表,请与美国华裔教授专家网联系。
Copyright © 2023 ScholarsUpdate.com. All Rights Reserved.